"Measurement and Field Simulation based Characterization of Plastic IC Packages," Ferenc Mernyei, 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, Oct. 1997.
"A Novel Approach to 3-D Modeling of Packaged RF Power Transistors Ted Johansson and Torkel Arnborg,”IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 47, NO. 6, JUNE 1999.
"Carsem's electrical data,"; A good basis for a lumped package model (lead frame&bondwires) for most modern plasitic packages.
"Fundamentals of IC Assembly," Virginia Tech.
The Nordic Electronics Packaging Guideline; Chapter A: Wire Bonding
Bondwire Current density and Resistance Properties